%0 Conference Proceedings %T A Better Grasp on Pictures Under Glass: Comparing Touch and Tangible Object Manipulation using Physical Proxies %+ Analysis and Visualization (AVIZ) %+ Université Paris-Sud - Paris 11 (UP11) %+ Télécom ParisTech %+ Polytechnic institute of New York University (NYU-Poly) %A Le Goc, Mathieu %A Dragicevic, Pierre %A Huron, Samuel %A Boy, Jeremy %A Fekete, Jean-Daniel %< avec comité de lecture %B Proceedings of the International Working Conference on Advanced Visual Interfaces (AVI) %C Bari, Italy %8 2016-06-05 %D 2016 %R 10.1145/2909132.2909247 %K physical proxies %K Tangible user interfaces %K touch interfaces %Z Computer Science [cs] %Z Computer Science [cs]/Human-Computer Interaction [cs.HC]Conference papers %X We introduce a novel method based on physical proxies for investigating fundamental differences between touch and tangible interfaces. This method uses physical chips to emulate the flat, non-graspable objects that make up touch interfaces , in a way that supports direct comparison with tangible interfaces. We ran an experiment to test the effect of object thickness on participants' behavior, performance and subjective experience in spatial rearrangement tasks. We found that for the tasks tested, thick objects are faster but less accurate to operate, and that their graspability is only used occasionally. We also found that coarse manipulation of multiple thin objects is error-prone, an issue that only thick objects may allow to alleviate. %G English %2 https://inria.hal.science/hal-01323474/document %2 https://inria.hal.science/hal-01323474/file/A%20Better%20Grasp%20on%20Pictures%20Under%20Glass%20-%20Comparing%20Touch%20and%20Tangible%20Object%20Manipulation%20using%20Physical%20Proxies.pdf %L hal-01323474 %U https://inria.hal.science/hal-01323474 %~ INSTITUT-TELECOM %~ CNRS %~ INRIA %~ UNIV-PSUD %~ ENST %~ INRIA-SACLAY %~ TELECOM-PARISTECH %~ PARISTECH %~ INRIA_TEST %~ TESTALAIN1 %~ UMR8623 %~ CENTRALESUPELEC %~ INRIA2 %~ UNIV-PARIS-SACLAY %~ UNIV-PSUD-SACLAY %~ INRIA-SACLAY-2015 %~ TELECOM-PARISTECH-SACLAY %~ CENTRALESUPELEC-SACLAY %~ I3-TPT %~ SES %~ SID %~ LISN %~ GS-ENGINEERING %~ GS-COMPUTER-SCIENCE %~ LISN-AVIZ %~ NOS %~ INRIA-ETATSUNIS %~ UMR_I3